Samsung HBM3

Basic Information

Category: Memory Chip

Brand: Samsung

Applications

Server · Automotive · Networking

Key Specifications

Model: KHBA84A03D-MC1H | Capacity: 16GB | Architecture: 1024 | Data Rate: 6.4 Gbps

Model: KHBAC4A03D-MC1H | Capacity: 24GB | Architecture: 1024 | Data Rate: 6.4 Gbps

Model: KHBA84A03C-MC1H | Capacity: 16GB | Architecture: 1024 | Data Rate: 6.4 Gbps

Model: KHBAC4A03C-MC1H | Capacity: 24GB | Architecture: 1024 | Data Rate: 6.4 Gbps

Product Description

Samsung HBM3 Icebolt stacks twelve layers of 10nm-class 16Gb DRAM dies, delivering capacities of up to 24GB. It supports data transfer speeds of up to 6.4 Gbps and provides a total bandwidth of up to 819 GB/s.

Designed with ultra-high efficiency, Samsung HBM3 improves energy efficiency by approximately 10% compared with the previous generation, helping reduce server workload while delivering higher performance.