Samsung eMCP LPDDR3
Samsung eMCP LPDDR3
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Samsung eMCP LPDDR3
| Model | Configuration | Architecture | Speed | Package |
|---|---|---|---|---|
| KMF720012M-B214 | eMMC 8GB(T) + LPDDR3 8Gb | X8, X32 | 1600Mbps | 221FBGA |
| KMFN10012M-B214 | eMMC 8GB(M) + LPDDR3 8Gb | X8, X32 | 1600Mbps | 221FBGA |
| KMQ310013M-B419 | eMMC 16GB(M) + LPDDR3 16Gb | X8, X32 | 1600Mbps | 221FBGA |
| KMQ820013M-B419 | eMMC 16GB(T) + LPDDR3 16Gb | X8, X32 | 1600Mbps | 221FBGA |
| KMR31000BA-B614 | eMMC 16GB(M) + LPDDR3 24Gb | X8, X32 | 1600Mbps | 221FBGA |
| KMQ210013M-B615 | eMMC 32GB(M) + LPDDR3 16Gb | X8, X32 | 1600Mbps | 221FBGA |
| KMQ4Z0013M-B809 | eMMC 32GB(T) + LPDDR3 16Gb | X8, X32 | 1600Mbps | 221FBGA |
| KMR21000BM-B809 | eMMC 32GB(M) + LPDDR3 24Gb | X8, X32 | 1600Mbps | 221FBGA |
Series Overview
Samsung eMCP LPDDR3 uses Multi-Chip Packaging (MCP) technology, integrating multiple storage chips in a single BGA package. Typically, it combines one NAND Flash chip with one low-power DRAM or Mobile RAM. This integration reduces interference, enhances communication between NAND Flash and DRAM, and improves overall chip performance.
Compared with two separate TSOP chips, MCP saves up to 70% of the space and can reduce the PCB footprint by 30%-40% for the final product. eMCP, based on MCP, combines an eMMC chip with low-power DRAM or Mobile RAM to meet the growing storage demands of smartphones, particularly for Android devices. It simplifies manufacturing, reduces costs, and shortens product development cycles, accelerating time-to-market.
