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Samsung eMCP LPDDR2 Series

Samsung eMCP LPDDR2 Series

常规价格 $0.00
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Samsung eMCP LPDDR2 Series

Type: Embedded   
Brand: Samsung
Applications: Tablets, Smartphones

Model Configuration Architecture Speed (MB/s) Package Remarks
KMN9W000RM eMMC 2GB + LPDDR2 256MB x8, x32 1066 162FBGA Mass Production
KMN9W000XM eMMC 2GB + LPDDR2 256MB x8, x16 1066 162FBGA Mass Production
KMNJS000FM eMMC 4GB + LPDDR2 512MB x8, x32 1066 162FBGA Mass Production
KMNJS000ZM eMMC 4GB + LPDDR2 512MB x8, x32 1066 162FBGA Mass Production
KMN5U000ZA eMMC 4GB + LPDDR2 512MB x8, x32 1066 162FBGA Mass Production
KMN5U000ZM eMMC 4GB + LPDDR2 512MB x8, x32 800 162FBGA Mass Production
KMN5U000FM eMMC 4GB + LPDDR2 512MB x8, x16 800 162FBGA Mass Production
KMN5X000ZM eMMC 4GB + LPDDR2 512MB x8, x32 1066 162FBGA Development
KMKJS000YA eMMC 4GB + LPDDR2 768MB x8, x32 800 162FBGA Sample
KMK5U000YM eMMC 4GB + LPDDR2 768MB x8, x32 1066 162FBGA Mass Production
KMKJS000VM eMMC 4GB + LPDDR2 1GB x8, x32 1066 162FBGA Mass Production
KMK5U000VM eMMC 4GB + LPDDR2 1GB x8, x32 1066 162FBGA Mass Production
KMK5X000VM eMMC 4GB + LPDDR2 1GB x8, x32 1066 162FBGA Development
KMKUS000VM eMMC 8GB + LPDDR2 1GB x8, x32 1066 162FBGA Mass Production
KMK7U000VM eMMC 8GB + LPDDR2 1GB x8, x32 1066 162FBGA Mass Production
KMK7X000VM eMMC 8GB + LPDDR2 1GB x8, x32 1066 162FBGA Development
KMK8X000VM eMMC 16GB + LPDDR2 1GB x8, x32 1066 162FBGA Development
KMK8U000VM eMMC 16GB + LPDDR2 1GB x8, x32 1066 162FBGA Mass Production
KMK3U000VM eMMC 16GB + LPDDR2 1GB x8, x32 1066 186FBGA Mass Production
KMI8U000MM eMMC 16GB + LPDDR2 2GB x8, x32 1066 186FBGA Development
KMI8X000VM eMMC 16GB + LPDDR2 2GB x8, x32 1066 162FBGA Development
KMK2U000VM eMMC 32GB + LPDDR2 1GB x8, x32 1066 186FBGA Mass Production
KMI4Z000MM eMMC 32GB + LPDDR2 2GB x8, x32 1066 162FBGA Development
KMK1U000VM eMMC 64GB + LPDDR2 1GB x8, x32 1066 186FBGA Mass Production


Series Overview

Samsung eMCP (embedded Multi-Chip Package) LPDDR2 series integrates NAND Flash and low-power DRAM (or Mobile RAM) in a single BGA package. MCP technology enables high performance by reducing interference and improving communication between the NAND Flash and DRAM. Compared to two separate TSOP chips, MCP saves up to 70% of board space, reducing PCB footprint by 30%-40% on average. This packaging solution simplifies manufacturing, lowers cost, and accelerates product development and time-to-market.

Samsung eMCP combines eMMC storage and low-power DRAM in one package to meet the increasing storage demands of modern smartphones, especially with larger OS and app code requirements on Android devices.

Available Configurations

  • eMMC 4GB + LPDDR2 256MB – 1GB
  • eMMC 8GB + LPDDR2 1GB
  • eMMC 16GB + LPDDR2 1GB / 2GB
  • eMMC 32GB + LPDDR2 1GB / 2GB
  • eMMC 64GB + LPDDR2 1GB


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