Key Features

• 128GB eMMC 5.0 managed NAND Flash memory solution

• High-density storage supporting advanced mobile and embedded applications

• Sequential Read/Write speeds up to 150 MB/s / 50 MB/s

• Random IOPS performance up to 3500 / 2000

• Compact FBGA package (11.5 x 13 x 1.4 mm) optimized for integration

• Complies with JEDEC eMMC 5.0 standards, backward compatible with 4.41/4.5

• Advanced security features: RPMB, Secure Erase, Secure Trim

• Integrated MMC controller with optimized firmware for stable performance

• Low power consumption suitable for mobile, automotive, and embedded devices

Product Overview

The Samsung KLMDG4UCTB-B041 is a high-density 128GB eMMC 5.0 managed NAND Flash solution designed to meet the demands of advanced consumer electronics and embedded platforms. By integrating high-performance NAND with an MMC controller in a compact FBGA package, this device offers sequential read speeds up to 150 MB/s and write speeds up to 50 MB/s, while delivering random IOPS up to 3500/2000. Its compliance with JEDEC eMMC 5.0 standards ensures seamless compatibility with a wide range of platforms, enabling faster time-to-market and robust system reliability.

Applications

• Smartphones and tablets with high-density storage requirements

• Automotive infotainment and navigation systems

• Industrial embedded computing platforms

• Portable multimedia and consumer electronics devices

• Any embedded systems requiring reliable 128GB storage capacity

Technical Specifications

Frequently Asked Questions (FAQ)

Q1: What performance does the Samsung KLMDG4UCTB-B041 deliver?

A1: It provides sequential read speeds up to 150 MB/s, write speeds up to 50 MB/s, and random IOPS performance of 3500/2000.

Q2: What types of devices typically use this high-density eMMC solution?

A2: It is widely used in smartphones, tablets, automotive infotainment, and industrial embedded platforms requiring large storage.

Q3: What security functions does this module support?

A3: The device includes advanced security features such as RPMB, Secure Erase, and Secure Trim for data integrity and system reliability.

Q4: How does its compact FBGA package help manufacturers?

A4: Its 11.5 x 13 x 1.4 mm footprint saves PCB space, allowing slimmer designs and efficient integration into high-performance devices.