Samsung KLM8G1GESD-B04Q eMMC 5.0 8GB Managed NAND Flash Memory
Samsung KLM8G1GESD-B04Q eMMC 5.0 8GB Managed NAND Flash Memory
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Key Features
• 8GB eMMC 5.0 managed NAND Flash memory
• Compact FBGA package optimized for mobile and embedded systems
• Sequential Read/Write speeds up to 180 MB/s / 20 MB/s
• Random IOPS performance up to 4000 / 700
• JEDEC-standardized interface ensures reliability and compatibility
• Advanced security features including RPMB, Secure Erase, and Secure Trim
• Integrated intelligent MMC controller with optimized firmware
• Low power consumption ideal for mobile devices and consumer electronics
Product Overview
The Samsung KLM8G1GESD-B04Q is an 8GB eMMC 5.0 managed NAND Flash solution designed for modern consumer electronics and embedded platforms. By integrating NAND Flash with a mature MMC controller, this module simplifies system design, improves reliability, and provides consistent storage performance. With sequential read speeds up to 180 MB/s and write speeds up to 20 MB/s, along with robust random performance, it delivers efficient data handling. Its JEDEC-standardized compliance ensures broad compatibility across chipsets and platforms.
Applications
• Smartphones and tablets
• Automotive infotainment and navigation systems
• Portable media and multimedia devices
• Industrial embedded platforms
• Consumer electronics requiring compact storage solutions
Technical Specifications
|
Parameter |
Specification |
|
Part Number |
KLM8G1GESD-B04Q |
|
Memory Type |
eMMC 5.0 Managed NAND Flash |
|
Density |
8GB |
|
Package |
11.5 x 13 x 1.0 mm FBGA |
|
Sequential Read |
Up to 180 MB/s |
|
Sequential Write |
Up to 20 MB/s |
|
Random Read IOPS |
Up to 4000 |
|
Random Write IOPS |
Up to 700 |
|
Bus Width |
x4 / x8 |
|
Operating Voltage |
VCCQ: 1.7–1.95V / 2.7–3.6V; VCC: 2.7–3.6V |
|
Operating Temperature |
0°C to 85°C |
|
Compliance |
JEDEC eMMC 5.0 Standard |
Frequently Asked Questions (FAQ)
Q1: What is the advantage of using the Samsung KLM8G1GESD-B04Q?
A1: It offers reliable embedded storage in a compact package with high-speed performance and low power consumption.
Q2: What devices typically use this eMMC solution?
A2: It is widely used in smartphones, tablets, automotive infotainment, and industrial embedded platforms.
Q3: What kind of data security features does it support?
A3: The module includes RPMB, Secure Erase, and Secure Trim for secure data handling and system reliability.
Q4: How does its compact FBGA package benefit device manufacturers?
A4: Its small 11.5 x 13 x 1.0 mm footprint enables manufacturers to design slimmer and more efficient devices.
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