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Samsung KLM8G1GESD-B04Q eMMC 5.0 8GB Managed NAND Flash Memory

Samsung KLM8G1GESD-B04Q eMMC 5.0 8GB Managed NAND Flash Memory

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Key Features

• 8GB eMMC 5.0 managed NAND Flash memory

• Compact FBGA package optimized for mobile and embedded systems

• Sequential Read/Write speeds up to 180 MB/s / 20 MB/s

• Random IOPS performance up to 4000 / 700

• JEDEC-standardized interface ensures reliability and compatibility

• Advanced security features including RPMB, Secure Erase, and Secure Trim

• Integrated intelligent MMC controller with optimized firmware

• Low power consumption ideal for mobile devices and consumer electronics

Product Overview

The Samsung KLM8G1GESD-B04Q is an 8GB eMMC 5.0 managed NAND Flash solution designed for modern consumer electronics and embedded platforms. By integrating NAND Flash with a mature MMC controller, this module simplifies system design, improves reliability, and provides consistent storage performance. With sequential read speeds up to 180 MB/s and write speeds up to 20 MB/s, along with robust random performance, it delivers efficient data handling. Its JEDEC-standardized compliance ensures broad compatibility across chipsets and platforms.

Applications

• Smartphones and tablets

• Automotive infotainment and navigation systems

• Portable media and multimedia devices

• Industrial embedded platforms

• Consumer electronics requiring compact storage solutions

Technical Specifications

Parameter

Specification

Part Number

KLM8G1GESD-B04Q

Memory Type

eMMC 5.0 Managed NAND Flash

Density

8GB

Package

11.5 x 13 x 1.0 mm FBGA

Sequential Read

Up to 180 MB/s

Sequential Write

Up to 20 MB/s

Random Read IOPS

Up to 4000

Random Write IOPS

Up to 700

Bus Width

x4 / x8

Operating Voltage

VCCQ: 1.7–1.95V / 2.7–3.6V; VCC: 2.7–3.6V

Operating Temperature

0°C to 85°C

Compliance

JEDEC eMMC 5.0 Standard

Frequently Asked Questions (FAQ)

Q1: What is the advantage of using the Samsung KLM8G1GESD-B04Q?

A1: It offers reliable embedded storage in a compact package with high-speed performance and low power consumption.

Q2: What devices typically use this eMMC solution?

A2: It is widely used in smartphones, tablets, automotive infotainment, and industrial embedded platforms.

Q3: What kind of data security features does it support?

A3: The module includes RPMB, Secure Erase, and Secure Trim for secure data handling and system reliability.

Q4: How does its compact FBGA package benefit device manufacturers?

A4: Its small 11.5 x 13 x 1.0 mm footprint enables manufacturers to design slimmer and more efficient devices.

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