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Samsung KLM8G1GESD-B04P eMMC 5.0 8GB Managed NAND Flash Memory

Samsung KLM8G1GESD-B04P eMMC 5.0 8GB Managed NAND Flash Memory

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Key Features

• 8GB eMMC 5.0 managed NAND Flash memory solution

• Compact FBGA package optimized for space-constrained mobile devices

• Sequential Read/Write speeds up to 180 MB/s / 20 MB/s

• Random IOPS performance up to 4000 / 700

• Standardized JEDEC interface ensures reliability and compatibility

• Security functions including RPMB, Secure Erase, and Secure Trim

• Integrated intelligent MMC controller with advanced firmware

• Low power consumption ideal for smartphones, tablets, and portable multimedia systems

Product Overview

The Samsung KLM8G1GESD-B04P is an 8GB eMMC 5.0 managed NAND Flash solution designed for consumer electronics and embedded systems requiring reliable, compact storage. It combines advanced NAND Flash with an MMC controller in a small FBGA package, delivering sequential read speeds up to 180 MB/s and write speeds up to 20 MB/s. With random IOPS performance of 4000/700, along with JEDEC-compliant security and reliability features, this eMMC solution supports efficient and secure data management. Its low power operation makes it well-suited for mobile and multimedia applications.

Applications

• Smartphones and tablets

• Portable multimedia and navigation devices

• Automotive infotainment systems

• Industrial embedded computing platforms

• Consumer electronics requiring compact storage solutions

Technical Specifications

Parameter

Specification

Part Number

KLM8G1GESD-B04P

Memory Type

eMMC 5.0 Managed NAND Flash

Density

8GB

Package

11.5 x 13 x 1.0 mm FBGA

Sequential Read

Up to 180 MB/s

Sequential Write

Up to 20 MB/s

Random Read IOPS

Up to 4000

Random Write IOPS

Up to 700

Bus Width

x4 / x8

Operating Voltage

VCCQ: 1.7–1.95V / 2.7–3.6V; VCC: 2.7–3.6V

Operating Temperature

0°C to 85°C

Compliance

JEDEC eMMC 5.0 Standard

Frequently Asked Questions (FAQ)

Q1: What performance can the Samsung KLM8G1GESD-B04P deliver?

A1: It provides sequential read speeds up to 180 MB/s, write speeds up to 20 MB/s, and random IOPS performance of 4000/700.

Q2: What applications is this memory solution best suited for?

A2: It is commonly used in smartphones, tablets, automotive infotainment, and portable multimedia devices.

Q3: Does this module support advanced security features?

A3: Yes, it supports RPMB, Secure Erase, and Secure Trim for secure and reliable data handling.

Q4: How does its compact FBGA package benefit device design?

A4: With a size of 11.5 x 13 x 1.0 mm, it saves PCB space, allowing manufacturers to design slimmer and more efficient devices.

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