Key Features

• 8GB eMMC 5.0 managed NAND Flash memory

• Compact FBGA package (11.5 x 13 x 1.0 mm) optimized for mobile and embedded systems

• Sequential Read/Write speeds up to 180 MB/s / 20 MB/s

• Random IOPS performance up to 4000 / 700

• JEDEC-standardized interface ensures broad compatibility and reliability

• Supports advanced security features such as RPMB, Secure Erase, and Secure Trim

• Integrated intelligent MMC controller with firmware optimization

• Low power consumption suitable for smartphones, tablets, and consumer electronics

Product Overview

The Samsung KLM8G1GESD-B03Q is an 8GB eMMC 5.0 managed NAND Flash solution built for consumer electronics and embedded systems that require reliable storage with compact design. By combining NAND Flash with an MMC controller in a small FBGA package, it delivers sequential read speeds up to 180 MB/s and write speeds up to 20 MB/s, along with robust random read/write performance. Its JEDEC-standardized interface ensures compatibility across a wide range of platforms, while advanced security features and low power consumption make it well-suited for mobile devices.

Applications

• Smartphones and tablets

• Automotive infotainment and navigation systems

• Portable multimedia devices

• Industrial and embedded computing systems

• Consumer electronics requiring compact storage solutions

Technical Specifications

Frequently Asked Questions (FAQ)

Q1: What are the performance specifications of the Samsung KLM8G1GESD-B03Q?

A1: It provides sequential read speeds up to 180 MB/s, write speeds up to 20 MB/s, and random IOPS of 4000/700.

Q2: What devices typically use this eMMC solution?

A2: It is widely used in smartphones, tablets, automotive infotainment systems, and portable multimedia devices.

Q3: What security features does the module include?

A3: It supports RPMB, Secure Erase, and Secure Trim for enhanced data security and reliability.

Q4: How does the compact FBGA package benefit device design?

A4: With a footprint of 11.5 x 13 x 1.0 mm, it saves PCB space, enabling slimmer device designs and efficient embedded applications.