Key Features

• 8GB eMMC 5.0 managed NAND Flash memory solution

• Compact FBGA package (11.5 x 13 x 1.0 mm) ideal for mobile and embedded systems

• Sequential Read/Write speeds up to 180 MB/s / 20 MB/s

• Random IOPS performance up to 4000 / 700

• JEDEC-standardized interface ensures broad compatibility and reliability

• Advanced security features: RPMB, Secure Erase, Secure Trim

• Integrated intelligent MMC controller with optimized firmware

• Low power consumption optimized for smartphones, tablets, and automotive systems

Product Overview

The Samsung KLM8G1GESD-B03P is an 8GB eMMC 5.0 managed NAND Flash solution designed for next-generation mobile and embedded devices. It combines high-performance NAND Flash with an integrated MMC controller, delivering sequential read speeds up to 180 MB/s and write speeds up to 20 MB/s, as well as random read/write IOPS performance of 4000/700. Its compliance with JEDEC eMMC 5.0 standards ensures seamless integration, robust reliability, and simplified system design. With advanced security features and low power operation, it is ideal for smartphones, tablets, infotainment systems, and compact consumer electronics.

Applications

• Smartphones and tablets

• Automotive infotainment and navigation systems

• Portable multimedia devices

• Industrial and embedded computing platforms

• Consumer electronics requiring compact embedded storage

Technical Specifications

Frequently Asked Questions (FAQ)

Q1: What is the performance capability of the Samsung KLM8G1GESD-B03P?

A1: It supports sequential read speeds up to 180 MB/s, write speeds up to 20 MB/s, and random IOPS of 4000/700.

Q2: Which applications is this memory solution suited for?

A2: It is used in smartphones, tablets, automotive infotainment, and embedded platforms requiring efficient storage.

Q3: What security features are available?

A3: The module includes RPMB, Secure Erase, and Secure Trim functions for advanced data protection.

Q4: How does the FBGA package benefit device manufacturers?

A4: Its compact size (11.5 x 13 x 1.0 mm) allows efficient use of PCB space, enabling slimmer and more integrated designs.