{"product_id":"ddr3-2gb-sdram-f-die-1600-1866-2133-mbps","title":"DDR3 2Gb SDRAM (F-die) – 1600 \/ 1866 \/ 2133 Mbps","description":"\u003ch2\u003eSamsung DDR3 2Gb SDRAM (F-die) – 1600 \/ 1866 \/ 2133 Mbps\u003c\/h2\u003e\n\u003cp\u003e\u003cstrong\u003e2Gb DDR3 FBGA Memory for Legacy Platforms, Industrial Boards and System Maintenance\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eSamsung DDR3 2Gb F-die SDRAM is designed for stable, long-cycle system applications requiring consistent bandwidth and low operating power. Supporting transfer rates up to 2133Mb\/sec per pin (DDR3-2133), this device remains widely deployed in embedded platforms, desktops, notebooks, automotive electronics and medical control systems built around DDR3 architecture.\u003c\/p\u003e\n\u003cp\u003eFor customers sourcing \u003cem\u003eSamsung DDR3 2Gb 2133 memory chip\u003c\/em\u003e, maintaining \u003cem\u003eDDR3 1600 1866 industrial DRAM supply\u003c\/em\u003e, or qualifying \u003cem\u003e2Gb DDR3 FBGA x8 device\u003c\/em\u003e for legacy production, this series provides a practical solution without migrating to newer memory generations.\u003c\/p\u003e\n\u003ch3\u003eArchitecture \u0026amp; Electrical Characteristics\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eDensity: 2Gb\u003c\/li\u003e\n\u003cli\u003eDie revision: F-die\u003c\/li\u003e\n\u003cli\u003eOrganization: 32Mbit × 8 I\/Os × 8 banks\u003c\/li\u003e\n\u003cli\u003eSpeed grades: DDR3-1600 \/ DDR3-1866 \/ DDR3-2133\u003c\/li\u003e\n\u003cli\u003eTransfer rate: Up to 2133Mb\/sec\/pin\u003c\/li\u003e\n\u003cli\u003eVoltage: 1.5V ± 0.075V (VDD \/ VDDQ)\u003c\/li\u003e\n\u003cli\u003ePackage: 78-ball FBGA (x8)\u003c\/li\u003e\n\u003cli\u003eDifferential clock input (CK \/ CK#)\u003c\/li\u003e\n\u003cli\u003eDQS-based source synchronous data interface\u003c\/li\u003e\n\u003cli\u003eRAS\/CAS multiplexed addressing\u003c\/li\u003e\n\u003cli\u003eSupported features: Posted CAS, Programmable CWL, Internal Self Calibration, On-Die Termination (ODT), Asynchronous Reset\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003ePower \u0026amp; Performance Positioning\u003c\/h3\u003e\n\u003cp\u003eCompared with DDR2 platforms, DDR3 architecture doubles bandwidth while reducing power consumption by up to 30%. Built on Samsung 30nm class DRAM technology, this device supports efficient thermal behavior and lower total cost of ownership in power-sensitive systems.\u003c\/p\u003e\n\u003ch3\u003ePart Number List – Samsung DDR3 2Gb Series\u003c\/h3\u003e\n\u003ctable border=\"1\" cellspacing=\"0\" cellpadding=\"6\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003cth\u003ePart Number\u003c\/th\u003e\n\u003cth\u003eDensity\u003c\/th\u003e\n\u003cth\u003ePackage\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G1646F-BYNB\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G0846F-BCK0\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G0846F-BCMA\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G0846F-BCNB\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G0846F-BMK0\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G0846F-BMMA\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G0846F-BYMA\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G0846F-BYNB\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G1646F-BCK0\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G1646F-BCMA\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G1646F-BCNB\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G1646F-BFMA\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G1646F-BHMA\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G1646F-BMK0\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eK4B2G1646F-BMMA\u003c\/td\u003e\n\u003ctd\u003e2Gb\u003c\/td\u003e\n\u003ctd\u003eFBGA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003e\n\u003cbr\u003eFAQ – Technical Clarification\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003e1. What system clock rates are supported?\u003c\/strong\u003e\u003cbr\u003eThis series supports DDR3-1600, DDR3-1866, and DDR3-2133 speed grades, delivering up to 2133Mb\/sec per pin depending on controller configuration.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e2. What are the voltage requirements for board design?\u003c\/strong\u003e\u003cbr\u003eThe device operates at a single 1.5V ±0.075V supply for both VDD and VDDQ, consistent with standard DDR3 system design.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e3. What packaging and bus width configuration is used?\u003c\/strong\u003e\u003cbr\u003eThe 2Gb F-die device is organized as 32Mbit × 8 I\/Os × 8 banks and supplied in a 78-ball FBGA (x8) package.\u003c\/p\u003e\n\u003cdiv style=\"margin-top: 40px; padding: 25px; border: 1px solid #e5e5e5; background-color: #f7f9fc; border-radius: 8px;\"\u003e\n\u003ch3 style=\"margin: 0 0 10px 0; color: #0a3d62; font-size: 22px; font-weight: 600;\"\u003eSOURCEMEMORYCHIPS\u003c\/h3\u003e\n\u003cp style=\"margin: 0 0 18px 0; color: #1c1c1c; font-size: 15px;\"\u003eYour Leading Global Supplier for Professional Memory Chip Sourcing\u003c\/p\u003e\n\u003cdiv style=\"line-height: 1.8; font-size: 15px;\"\u003e\n\u003cp style=\"margin: 5px 0;\"\u003e\u003cspan style=\"color: #0a3d62; font-weight: 600;\"\u003eWhatsApp:\u003c\/span\u003e \u003ca href=\"https:\/\/wa.me\/17028866700\" style=\"color: #e67e22; text-decoration: none; font-weight: 600;\"\u003e +1 702 886 6700 \u003c\/a\u003e\u003c\/p\u003e\n\u003cp style=\"margin: 5px 0;\"\u003e\u003cspan style=\"color: #0a3d62; font-weight: 600;\"\u003eEmail:\u003c\/span\u003e \u003ca href=\"mailto:sales@sourcememorychips.com\" style=\"color: #e67e22; text-decoration: none; font-weight: 600;\"\u003e sales@sourcememorychips.com \u003c\/a\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cp style=\"margin-top: 15px; font-size: 13px; color: #666;\"\u003eFast response for DDR, NAND, eMMC, LPDDR and industrial memory inquiries.\u003c\/p\u003e\n\u003c\/div\u003e","brand":"我的商店","offers":[{"title":"Default Title","offer_id":47747215163631,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0771\/8305\/8159\/files\/K4B2G1646F.png?v=1771498958","url":"https:\/\/www.sourcememorychips.com\/products\/ddr3-2gb-sdram-f-die-1600-1866-2133-mbps","provider":"SMC","version":"1.0","type":"link"}